FSP Group to Showcase High-Density, High-Efficiency Power Solutions for AI, Edge Computing, Networking, and Embedded Systems at embedded world 2026

 

[Taipei, Feb 24^th, 2026] FSP Group today announced its participation in embedded world 2026 (10–12 March 2026, NürnbergMesse, Nuremberg). At Hall 1, Booth 1-448, FSP will present next-generation power solutions with increased power capacity and top efficiency to support AI and edge computing, networking platforms, and industrial embedded systems. FSP is also expanding beyond industrial applications into medical and domestic environments, with product designs aligned to the relevant safety and application standards.

 

FSP’s embedded world 2026 highlights focus on the requirements most often raised by developers and system architects: higher power density with lower heat, system uptime and serviceability, compliance-ready designs, a wide operating envelope, integration simplicity, and standardized external power.

Spotlight products

New Power Shelf for AI servers and modern data centers — European debut (21-inch rack)
FSP will show its new Power Shelf family in Europe for the first time, designed for 21-inch width racks and high-density AI infrastructure.

• Models: 33kW Power shelf YPSA3302TH-1R00R60 with six 5500W 1U power supplies
• Uptime / serviceability: PMBus /ORV3 RJ45 PMM-Modbus digital power management for monitoring and control
• Efficiency: meet 80 PLUS Ruby standard to reduce power loss and thermal load
• Operating envelope: 200–277Vac (±10%) wide input range for modern data center power environments
• Use cases: IT and storage servers, IoT / AIoT platforms, and edge AI servers

FSP4000-20HM — 4000W CRPS redundant PSU for data center, storage, and edge AI
To meet increasing AI power demand, FSP expands its CRPS lineup with a new high-power model.

• Efficiency: meet 80 PLUS Titanium
• Uptime / serviceability: PMBus telemetry for remote monitoring and platform integration
• Power: 4000W
• Use cases: Ideal for data center, storage, and edge AI servers

Medical-grade high-power ATX for GPU-accelerated imaging and medical workstations
FSP will present high-efficiency ATX power supplies for advanced medical computing and imaging workloads.

• Models: FSP900M-60PJ (900W) and FSP1000M-60PG (1000W)
• Compliance-ready: IEC 60601-1 and IEC 62368-1 certified, Intel ATX12V V3.1 compliance
• Efficiency: meet 80 PLUS Gold efficiency for reduced heat in compact systems
• Use cases: GPU-accelerated medical imaging devices, high-performance medical PCs/workstations

FSP2500-57APB — 2500W ATX 12V v3.1 PSU for PCIe Gen5 GPU compute platforms
For high-power GPU systems and development workstations requiring modern connector support.

• Integration simplicity: Intel PSDG ATX 12V v3.1, PCIe Gen5 regulation
• Standardized power for GPUs: 4× PCIe Gen5 (12V-2x6) connectors
• Efficiency: 80 PLUS 230V EU Platinum
• Power: 2500W

New Panel Mount series — enclosure-ready installation with improved EMC/EMI performance
Designed to accelerate integration and expand use in safety-driven applications.

• 100-500W panel-mount PSUs: FSP100/150/200-PNA, FSP300-PBA, FSP500-PBB
• Integration simplicity: enclosed panel-mountable design—no additional enclosure design required
• Compliance-ready: IEC/EN 62368 certified; design-ready for IEC 60335 requirements
• EMC/EMI: improved performance to support smoother system qualification
• Wide operating envelope: peak power function for dynamic loads

Expanded AC-DC and USB-C PD adapter portfolio
FSP will also present AC-DC power supplies and USB-C PD adapters with extended wattage options, supporting standardized external power and easier field replacement across embedded device platforms.

Meet FSP at embedded world 2026

FSP specialists will be on site to discuss power architecture, PMBus integration, redundancy strategies, thermal/derating planning, and compliance pathways, as well as customized power solutions for customer platforms.